标准号:ASTM B579-1973(2004)
中文标准名称:锡铅合金的电解沉积镀层(焊接板)
英文标准名称:Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)
标准类型:A29
发布日期:1999/12/31 12:00:00
实施日期:1999/12/31 12:00:00
中国标准分类号:A29
国际标准分类号:25.220.40 (Metallic coatings)
适用范围: Note 1-Some corrosion of tin-lead coatings may be expected in outdoor exposure. In normal indoor exposure, tin-lead is protective on iron, copper, and copper alloys. Corrosion may be expected at discontinuities (pits or pores) in the coating. Porosity decreases as the thickness is increased. A primary use of the tin-lead coating (solder) is with the printed circuit industry as a solderable coating and as an etch mask material.
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